Prototron Soldermask

Via-Fill Equipment Acquisition (Redmond & Tucson Facilities)

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By Prototron News | Published on: July 09, 2015

Prototron Circuits is pleased to announce the installation of via-fill equipment for both company facilities (Redmond & Tucson). This improvement will provide our customers a full via-fill solution. 

Commenting on this new capability, Redmond General Manager Kirk Williams said, "This is an important acquisition and addition to our capabilities. Over the past year, it has become increasingly evident that more and more of our customers are requiring via-fill technology. We had previously supported this requirement as an 'outside service' requiring 3 extra days to process. Bringing the necessary equipment 'in-house' will allow us to improve our overall turn time and provide the time critical response that our customers have come to expect. In addition, it gives Prototron complete control of a critical process that had been previously subcontracted out."

Redmond Via-Fill

For our Redmond facility we acquired and installed a ITC Intercircuit THP32 Double Chamber Hole Filler, and a Wise-Flatstar Planarizer. The pictures below show the installed equipment:

ITC Intercircuit
ITC Intercircuit THP32 (Click Image to see Larger Version)

Wise-Flatstar
Wise-Flatstar Planarizer (Click Image to see Larger Version)

Tucson Via-Fill

For our Tucson facility we acquired and installed a MASS VHF200 Via Fill - Heated Head & ES10 Savenger, and a Pola & Massa PEM Planarizer Evolution 3000. The pictures below show the installed equipment:

MASS VHF200
MASS VHF200 (Click Image to see Larger Version)

Pola & Massa
Pola & Massa PEM Planarizer (Click Image to see Larger Version)

Contact

Redmond Facility
15225 NE 95th Street
Redmond, WA 98052

Toll: 888.847.7686
Phone: 425.823.7000
Fax: 425.869.2515
email: Info@Prototron.com

Tucson Facility
3760 E. 43rd Place
Tucson, AZ 85713

Toll: 800.279.5572
Phone: 520.745.8515
Fax: 520.747.8334
email: Info@PrototronSW.com

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