Manufacturing Capabilities

The information on this page shows our current manufacturing capabilities for each of our facilities. If you have any question please don't hesitate to contact us, we're here to help!
Our Manufacturing Capabilities
Description Double-Sided PCB Multi-Layer PCB
Minimum Core Thickness N/A 0.003
Minimum Prepreg Dielectric Thickness* N/A 0.0035
Minimum PTH** Annular Ring 0.002 0.002
Minimum Pad to Plane Clearance 0.015 0.015
Smallest Finished Plated Hole Size 0.003 0.003
Buried Via Hole Size N/A .008 - .015
Buried Via Annular Ring N/A 0.001
Minimum Annular Ring to Tent NPTH***/Side 0.012 0.012
Minimum Copper to Edge of Board .005 Std FR4 Mat .005 Std FR4 Mat
Minimum NPTH*** to Edge of Board 0.05 0.05
Annular Ring for Pad on NPTH*** 0.01 0.01
Blind Via Hole Size N/A .0059 - .015
Blind Via Annular Ring N/A 0.002
Internal Ground Clearance N/A 0.015
Minimum Internal Annular Ring N/A 0.001
Minimum Trace - Trace Space 0.004 0.004
Minimum Pad - Trace Space 0.004 0.004
Minimum Trace - NPTH*** Space 0.008 0.008
Minimum Trace - Edge of Board 0.02 0.02
Minimum Pad - Edge of Board 0.02 0.02
Minimum SMT**** Width 0.01 0.01
Minimum SMT**** Web 0.005 0.005
Minimum Mask Annular Ring 0.003 0.003
Minimum Mask Web 0.005 0.005
Minimum Mask Clearance to Trace 0.005 0.005
Legend Width 0.007 0.007

* - .0035 Minimum based off of IPC Standards, may be lower if specified by Customer

** - Plated Through Hole (PTH)

*** - Non-Plated Through Hole (NPTH)

**** - Surface-Mount Technology (SMT)

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Company Guide

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